BGA flip chip underfill epoxy adhesive (translator)

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BGA flip chip underfill epoxy adhesive
BGA flip chip underfill epoxy adhesive

DeepMaterial offers high performing materials for Sintering and Die Attach, Surface Mount, and Wave Soldering applications. The breadth of products includes Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills and Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, and Stencils

 

Native language: Chinese
Translates from: English, Chinese
Translates into: English, Chinese


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