UV Moisture Dual Curing Adhesive (translator)

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UV Moisture Dual Curing Adhesive

Uv moisture dual curing adhesive

Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C. 


Native language: English
Translates from: English, Estonian
Translates into: English, Estonian


User links: Website


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